Item | Technical Parameters | |
Min Track Width / Space ( Mil ) | 4mil(prototype run) 4mil(Production run) | |
Min Hole Size | Board Thickness <= 1.6mm | 0.30mm |
Min router size | 0.80mm | |
Board Thickness > 1.6mm | 1:8(hole size/board thickness) | |
Max Layer |
| 20 Layer(prototype run) 12 layer(production run) |
Min Annular Ring Width | Vias | 5 Mil |
Component Vias | 6 Mil | |
Min Board Thickness | Double sided | 0.2mm |
Multilayer | 4 - 6 layer : 0.8mm ~ 6mm | |
8 - 12 layer : 1.0mm ~ 6mm | ||
14 - 18 layer : 1.5mm ~ 6mm | ||
20 layer : 2.4mm ~ 6mm | ||
Max Board Size | Double Sided | 550mm X 650mm |
Multilayer | 500mm X 600mm |
Drilling Tolerance | Location : +/- 3mil | |
Dimension : +/- 2mil | ||
Outer shape Tolerance | +/- 0.15mm | |
Min PTH Copper Wall | 20um | |
Warp |
| < 1% |
Clearance Between track and board edge | Routing : 0.20mm | |
V-Cut : 0.40mm | ||
Solder Mask | Mask Window | min 3 mil |
Mask Bridge | Min 4 mil | |
Color | White, Black, Blue, Green, Yellow, Red | |
Plating / Finishing | HAL, Nickel Plating, Silver Plating, Immersion Nickel, Immersion Gold, Immersion Silver, Golden Finger | |
Board Material | FR1, CAM1, FR4, High TG, Aluminium Based, Thick Copper, Rogers. |
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