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Technical Parameters

Min Track Width / Space ( Mil )

4mil(prototype run) 4mil(Production run)

Min Hole Size

Board Thickness <= 1.6mm

0.30mm

Min router size

0.80mm

Board Thickness > 1.6mm

1:8(hole size/board thickness)

Max Layer

 

20 Layer(prototype run)  12 layer(production run)

Min Annular Ring Width

Vias

5 Mil

Component Vias

6 Mil

Min Board Thickness

Double sided

0.2mm

Multilayer

4 - 6 layer : 0.8mm ~ 6mm

8 - 12 layer : 1.0mm ~ 6mm

14 - 18 layer : 1.5mm ~ 6mm

20 layer : 2.4mm ~ 6mm

Max Board Size

Double Sided

550mm X 650mm

Multilayer

500mm X 600mm

 

Drilling Tolerance

Location : +/- 3mil

Dimension : +/- 2mil

Outer shape Tolerance

+/- 0.15mm

Min PTH Copper Wall

20um

Warp

 

< 1%

Clearance Between track and board edge

Routing : 0.20mm

V-Cut : 0.40mm

Solder Mask

Mask Window

min 3 mil

Mask Bridge

Min 4 mil

Color

White, Black, Blue, Green, Yellow, Red

Plating / Finishing

HAL, Nickel Plating, Silver Plating, Immersion Nickel, Immersion Gold, Immersion Silver, Golden Finger

Board Material

FR1, CAM1, FR4, High TG, Aluminium Based, Thick Copper, Rogers.

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